PD IEC/TS 62878-2-3:2015 - Device embedded substrate. Guidelines. Design guide

PD IEC/TS 62878-2-3:2015

Device embedded substrate. Guidelines. Design guide

Status : Current   Published : April 2015

Format
PDF

Format
HARDCOPY



IEC TS 62878-2-3:2015 describes the design guide of device embedded substrates. The design guide of device embedded substrate is essentially the same as that of various electronic circuit boards. This part of IEC 62878 enables a thorough understanding of circuit design, structure design, board design, board manufacturing, jisso (assembly processes) and tests of products. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.




Standard NumberPD IEC/TS 62878-2-3:2015
TitleDevice embedded substrate. Guidelines. Design guide
StatusCurrent
Publication Date30 April 2015
Normative References(Required to achieve compliance to this standard)IEC 60194
Informative References(Provided for Information)IEC 61189, IEC TS 62878-2-4, IEC TS 62878-2-1, IEC 62878-1-1, IEC 62421, IEC 61249
International RelationshipsIEC/TS 62878-2-3:2015
DescriptorsElectrical insulating materials, Chemical analysis and testing, Electrical testing, Electronic equipment and components, Printed-circuit boards, Statistical methods of analysis, Approval testing, Visual inspection (testing), Specimen preparation, Mechanical testing, Printed circuits, Precision, Environmental testing, Accuracy
ICS31.180
31.190
Title in FrenchSubstrat avec appareil(s) intégré(s). Directives. Guide de conception
CommitteeEPL/501
ISBN978 0 580 82124 0
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size1.929 MB
Price£182.00


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