BS EN 62878-1-1:2015 - Device embedded substrate. Generic specification. Test methods

BS EN 62878-1-1:2015

Device embedded substrate. Generic specification. Test methods

Status : Current   Published : July 2015

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IEC 62878-1-1:2015 specifies the test methods of passive and active device embedded substrates. The basic test methods of printed wiring substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.




Standard NumberBS EN 62878-1-1:2015
TitleDevice embedded substrate. Generic specification. Test methods
StatusCurrent
Publication Date31 July 2015
Normative References(Required to achieve compliance to this standard)IEC 60068-2-2:1974, IEC 60194, IEC 61189-3, IEC 60068-2-1, IEC/TS 62878-2-4:2015
Informative References(Provided for Information)EN ISO 3611, EN 61189-11, ISO 9455, EN ISO 2409, EN 60068-2-80, IEC 61189-1, EN ISO 9445-1, EN 60194, EN 61189-1, EN 60068-2-21, IEC 62421, EN ISO 291, IEC 60068-2-80, ISO 9453, EN 60068-2-38, EN 62137-1-3, IEC 60068-2-66, EN 61189-2, IEC 60068-2-14, EN 60068-2-78, EN 60068-2-64, EN 60068-2-1, IEC 61189-2, IEC 60068-2-6, EN 60068-2-30, EN ISO 9455, EN ISO 9453, EN 60068-2-2, IEC 62137-1-3, IEC 60068-2-38, EN 60068-2-6, EN 60068-2-58, EN 60068-2-14, EN ISO 15184, ISO 9445-1, IEC 61190-1-3, ISO 291:1994, ISO 4957, IEC 60068-2-53, BS EN ISO 4957:2018, IEC 60068-2-21, EN ISO 4957:2018, ISO 2409, EN 61190-1-3, IEC 61189-11, EN 61190-1-2, IEC 60068-2-58, EN 60068-2-53, IEC 62137-1-2, IEC 60068-2-20, IEC 60068-1, IEC 60068-2-64, EN 62421, IEC 60068-2-30, IEC 60068-2-78, EN 60068-1, ISO 3611, EN 62137-1-2, EN 61189-3, EN 60068-2-20, ISO 15184, IEC 61190-1-2, EN 60068-2-66
International RelationshipsEN 62878-1-1 (IEC 62878-1-1:20,IEC 62878-1-1:2015
DescriptorsSubstrates (insulating), Electric connectors, Electronic equipment and components, Components, Structures
ICS31.180
31.190
Title in FrenchSubstrat avec appareil(s) intégré(s). Spécification générique. Méthodes d'essai
Title in GermanTrägermaterial mit eingebetteten Bauteilen. Fachgrundspezifikation. Prüfverfahren
CommitteeEPL/501
ISBN978 0 580 82122 6
PublisherBSI
FormatA4
DeliveryYes
Pages62
File Size2.499 MB
Price£254.00


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