PD IEC/TS 62878-2-1:2015 - Device embedded substrate. Guidelines. General description of technology

PD IEC/TS 62878-2-1:2015

Device embedded substrate. Guidelines. General description of technology

Status : Current   Published : April 2015

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PDF

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HARDCOPY



IEC TS 62878-2-1:2015 describes the basics of device embedding substrate. It is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.




Standard NumberPD IEC/TS 62878-2-1:2015
TitleDevice embedded substrate. Guidelines. General description of technology
StatusCurrent
Publication Date30 April 2015
Normative References(Required to achieve compliance to this standard)IEC 60194, IEC 61189
Informative References(Provided for Information)IEC 62878-1-1, IEC TS 62878-2-4, IEC 62421:2007, IEC 60068-2, IEC 61249, JPCA–BU01–2007, JIS C 5603, JPCA-TD01-2008, IEC TS 62878-2-3
International RelationshipsIEC/TS 62878-2-1:2015
DescriptorsComponents, Electronic equipment and components, Substrates (insulating), Electric connectors, Structures
ICS31.180
31.190
Title in FrenchSubstrat avec appareil(s) intégré(s). Directives. Description générale de la technologie
CommitteeEPL/501
ISBN978 0 580 82120 2
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size1.215 MB
Price£214.00


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