BS EN ISO 9455-5:2014 - Soft soldering fluxes. Test methods. Copper mirror test

BS EN ISO 9455-5:2014

Soft soldering fluxes. Test methods. Copper mirror test

Status : Superseded, Withdrawn   Published : July 2014 Replaced By : BS EN ISO 9455-5:2020

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Standard NumberBS EN ISO 9455-5:2014
TitleSoft soldering fluxes. Test methods. Copper mirror test
StatusSuperseded, Withdrawn
Publication Date31 July 2014
Withdrawn Date20 October 2020
Normative References(Required to achieve compliance to this standard)ISO 9455-1, ISO 9455-2, ISO 9454-1
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN ISO 9455-5:2020
ReplacesBS EN 29455-5:1993, ISO 9455-5:1992
International RelationshipsISO 9455-5:2014,EN ISO 9455-5:2014
Draft Superseded By12/30270787 DC
DescriptorsSolders, Chemical-resistance tests, Specimen preparation, Reports, Fluxes (materials), Joining materials, Copper, Testing conditions
ICS25.160.50
Title in FrenchFlux de brasage tendre. Méthodes d'essai. Essai au miroir de cuivre
Title in GermanFlussmittel zum Weichlöten. Prüfverfahren. Kupferspiegeltest
CommitteeEPL/501
ISBN978 0 580 80540 0
PublisherBSI
FormatA4
DeliveryYes
Pages14
File Size1.051 MB
Price£112.00


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