BS EN 62047-9:2011 - Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS

BS EN 62047-9:2011

Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS

Status : Current   Published : January 2013

Format
PDF

Format
HARDCOPY






Standard NumberBS EN 62047-9:2011
TitleSemiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
StatusCurrent
Publication Date31 January 2013
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 62047-9:2011/COR1:2012
Amended ByCorrigendum, January 2013; Amendment, July 2007
DescriptorsAdhesion tests, Semiconductor technology, Integrated circuits, Adhesive strength, Visual inspection (testing), Shear testing, Bend testing, Electromechanical devices, Electronic equipment and components, Electrostatics, Substrates (insulating), Tensile testing, Bonding, Semiconductor devices
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Mesure de la résistance de collage de deux plaquettes pour les MEMS
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Prüfverfahren zur Festigkeit von Full-Wafer-Bondverbindungen in der Mikrosystemtechnik (MEMS)
CommitteeEPL/47
ISBN978 0 580 78793 5
PublisherBSI
FormatA4
DeliveryYes
Pages30
File Size1.661 MB
Price£182.00


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