BS EN 61190-1-2:2014 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
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BS EN 61190-1-2:2014

Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly

Status : Current   Published : June 2014

Format
PDF

Format
HARDCOPY



IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:


a) modification of the solder powder size in Table 2;


b) addition of the information of "Reflow condition and profile" in Annex B;


c) addition of a new Annex C.




Standard NumberBS EN 61190-1-2:2014
TitleAttachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
StatusCurrent
Publication Date30 June 2014
Normative References(Required to achieve compliance to this standard)IEC 61189-5-3, IEC 61190-1-3, ISO 9454-2, EN ISO 9454-2, EN 60194, EN 61190-1-3, IEC 61190-1-1, EN 61189-5-3, IEC 60194
Informative References(Provided for Information)IEC 61189-6:2006, EN 61189-6:2006, IEC 61189-5:2006, EN 61189-5:2006, IPC-HDBK-005
ReplacesBS EN 61190-1-2:2007
International RelationshipsEN 61190-1-2:2014,IEC 61190-1-2:2014
Draft Superseded By12/30258438 DC
DescriptorsElectrical connections, Quality control, Soldering, Solders, Soldered connectors, Classification systems, Electronic engineering, Quality assurance, Pastes, Electronic equipment and components, Bonding
ICS31.190
Title in FrenchMatériaux de fixation pour les assemblages électroniques. Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques
Title in GermanVerbindungsmaterialien für Baugruppen der Elektronik. Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage
CommitteeEPL/501
ISBN978 0 580 77840 7
PublisherBSI
FormatA4
DeliveryYes
Pages26
File Size1.418 MB
Price£182.00


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