BS EN 62047-22:2014 - Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates

BS EN 62047-22:2014

Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates

Status : Current   Published : October 2014

Format
PDF

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HARDCOPY



This part of IEC 62047 specifies a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates. Conductive thin-film structures on flexible substrates are extensively utilized in MEMS, consumer products, and flexible electronics. The electrical behaviours of films on flexible substrates differ from those of freestanding films and substrates due to their interfacial interactions. Different combinations of flexible substrates and thin films often lead to various influences on the test results depending on the test conditions and the interfacial adhesion. The desired thickness of a thin MEMS material is 50 times thinner than that of the flexible substrate, whereas all other dimensions are similar to each other.




Standard NumberBS EN 62047-22:2014
TitleSemiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
StatusCurrent
Publication Date31 October 2014
Normative References(Required to achieve compliance to this standard)EN ISO 527-3:1995, IEC 62047-3:2006, EN 62047-2:2006, EN 62047-8:2011, IEC 62047-8:2011, EN 62047-3:2006, ISO 527-3:1995, IEC 62047-2:2006
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 62047-22:2014,IEC 62047-22:2014
DescriptorsVibration, Bend testing, Test specimens, Integrated circuits, Resonance, Fatigue testing, Test equipment, Electronic equipment and components, Electromechanical devices, Semiconductor devices, Semiconductor technology, Thin-film devices
ICS01.080.99
31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Méthode d'essai de traction électromécanique pour les couches minces conductrices sur des substrats souples
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Elektromechanisches Zug-Prüfverfahren für leitfähige Dünnschichten auf flexiblen Substraten
CommitteeEPL/47
ISBN978 0 580 77555 0
PublisherBSI
FormatA4
DeliveryYes
Pages14
File Size1.213 MB
Price£112.00


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