BS EN 60191-6-22:2013 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

BS EN 60191-6-22:2013

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Status : Current   Published : April 2013

Format
PDF

Format
HARDCOPY



IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).




Standard NumberBS EN 60191-6-22:2013
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
StatusCurrent
Publication Date30 April 2013
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 60191-6, IEC 60191-6-5, IEC 60191-6-12
International RelationshipsEN 60191-6-22:2013,IEC 60191-6-22:2012
Draft Superseded By11/30248240 DC
DescriptorsDrawings, Engineering drawings, Integrated circuits, Semiconductor devices, Electronic equipment and components, Surface mounting devices, Standardization, Design, Rectangular shape, Square shape, Dimensions
ICS31.080.01
Title in FrenchNormalisation mécanique des dispositifs à semiconducteurs. Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs à montage en surface. Guide de conception pour les boîtiers matriciels à billes et à pas fins en silicium et boîtiers matriciels à zone de contact plate et à pas fins en silicium (S-FBGA et S-FLGA)
Title in GermanMechanische Normung von Halbleiterbauelementen. Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen. Konstruktionsleitfaden für Halbleitergehäuse Si-Feinraster-Ball-Grid- Array und Si-Feinraster-Land-Grid-Array (S-FBGA und S-FLGA)
CommitteeEPL/47
ISBN978 0 580 75720 4
PublisherBSI
FormatA4
DeliveryYes
Pages20
File Size1.104 MB
Price£130.00


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