BS EN 62047-12:2011 - Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

BS EN 62047-12:2011

Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Status : Current   Published : November 2011

Format
PDF

Format
HARDCOPY






Standard NumberBS EN 62047-12:2011
TitleSemiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
StatusCurrent
Publication Date30 November 2011
Normative References(Required to achieve compliance to this standard)IEC 62047-3:2006, ISO 12107, EN 62047-3:2006
Informative References(Provided for Information)IEC 62047-2:2006
International RelationshipsEN 62047-12:2011,IEC 62047-12:2011
Draft Superseded By10/30205425 DC
DescriptorsSemiconductor devices, Electronic equipment and components, Electromechanical devices, Semiconductor technology, Integrated circuits, Thin-film devices, Fatigue testing, Bend testing, Resonance, Vibration, Test specimens, Test equipment
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (MEMS)
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen
CommitteeEPL/47
ISBN978 0 580 76301 4
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size1.36 MB
Price£214.00


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