| Standard Number | BS EN 62047-12:2011 |
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| Title | Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures |
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| Status | Current |
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| Publication Date | 30 November 2011 |
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| Normative References(Required to achieve compliance to this standard) | IEC 62047-3:2006, ISO 12107, EN 62047-3:2006 |
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| Informative References(Provided for Information) | IEC 62047-2:2006 |
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| International Relationships | EN 62047-12:2011,IEC 62047-12:2011 |
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| Draft Superseded By | 10/30205425 DC |
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| Descriptors | Semiconductor devices, Electronic equipment and components, Electromechanical devices, Semiconductor technology, Integrated circuits, Thin-film devices, Fatigue testing, Bend testing, Resonance, Vibration, Test specimens, Test equipment |
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| ICS | 31.080.99
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| Title in French | Dispositifs à semiconducteurs. Dispositifs microélectromécaniques. Méthode d'essai de fatigue en flexion des matériaux en couche mince utilisant les vibrations à la résonance des structures à systèmes microélectromécaniques (MEMS) |
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| Title in German | Halbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Verfahren zur Prüfung der Biege-Ermüdungsfestigkeit von Dünnschichtwerkstoffen unter Verwendung der Resonanzschwingungen bei MEMS-Strukturen |
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| Committee | EPL/47 |
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| ISBN | 978 0 580 76301 4 |
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| Publisher | BSI |
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| Format | A4 |
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| Delivery | Yes |
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| Pages | 34 |
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| File Size | 1.36 MB |
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| Price | £214.00 |
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