BS EN 61249-4-19:2013 - Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

BS EN 61249-4-19:2013

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Status : Current   Published : February 2014

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IEC 61249-4-19:2013 gives requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-40 when manufacturing multilayer boards according to IEC 62326-4. Multilayer boards comprised of these materials are suitable for lead-free assembly processes. This material may be also used to bond other types of laminates. Prepreg according to this standard is of defined flammability (vertical burning test). The flammability rating on fully cured prepreg is achieved through the use of non-halogenated fire retardants contained as an integral part of the polymeric structure. After curing of the prepreg according to the supplier's instructions, the glass transition temperature is defined to be 170 °C minimum.




Standard NumberBS EN 61249-4-19:2013
TitleMaterials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
StatusCurrent
Publication Date28 February 2014
Normative References(Required to achieve compliance to this standard)EN ISO 14001:2004, IEC 61249-2-40, EN 61249-2-40, IEC/PAS 61249-6-3:2011, ISO 9000:2005, EN 61189-2:2006, ISO 11014:2009, IEC 61189-2:2006, EN ISO 9000:2005, ISO 14001:2004
Informative References(Provided for Information)IEC 60194:2006, IEC 62326-4
International RelationshipsEN 61249-4-19:2013,IEC 61249-4-19:2013
Draft Superseded By10/30235541 DC
DescriptorsSheet materials, Printed-circuit boards, Electronic equipment and components, Laminates, Reinforced materials, Quality assurance, Specification (approval), Epoxy resins, Printed circuits, Impregnated materials, Multilayered printed boards, Printed-circuit bases, Flammability, Epoxides, Textile glass
ICS31.180
Title in FrenchMatériaux pour circuits imprimés et autres structures d'interconnexion. Série de spécifications intermédiaires pour matériaux préimprégnés, non plaqués (pour la fabrication des cartes multicouches). Tissu de verre époxyde préimprégné non halogéné de type E à haute performance, d'inflammabilité définie (essai de combustion verticale), pour les assemblages sans plomb
Title in GermanMaterialen für Leiterplatten und andere Verbindungsstrukturen. Rahmenspezifikation für unkaschierte Prepreg-Materialien (zur Herstellung von Mehrlagenleiterplatten). Hochwertige mit E-Glasgewebe verstärkte Prepregs auf der Basis von halogenfreiem Epoxidharz mit definierter Brennbarkeit (Brennprüfung mit vertikaler Prüflingslage) für bleifreie Bestückungstechnik
CommitteeEPL/501
ISBN978 0 580 73076 4
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size485 KB
Price£130.00


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