BS EN 62047-14:2012 - Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials

BS EN 62047-14:2012

Semiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials

Status : Current   Published : May 2012

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PDF

Format
HARDCOPY



IEC 62047-14:2012 describes definitions and procedures for measuring the forming limit of metallic film materials with a thickness range from 0,5 ?m to 300 ?m. The metallic film materials described herein are typically used in electric components, MEMS and micro-devices. When metallic film materials used in MEMS (see 2.1.2 of IEC 62047-1:2005) are fabricated by a forming process such as imprinting, it is necessary to predict the material failure in order to increase the reliability of the components. Through this prediction, the effectiveness of manufacturing MEMS components by a forming process can also be improved, because the period of developing a product can be reduced and manufacturing costs can thus be decreased. This standard presents one of the prediction methods for material failure in imprinting process.




Standard NumberBS EN 62047-14:2012
TitleSemiconductor devices. Micro-electromechanical devices. Forming limit measuring method of metallic film materials
StatusCurrent
Publication Date31 May 2012
Normative References(Required to achieve compliance to this standard)EN 62047-1:2006, IEC 62047-1:2005
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 62047-14:2012,IEC 62047-14:2012
Draft Superseded By10/30232073 DC
DescriptorsElectronic equipment and components, Test specimens, Vibration, Resonance, Thin-film devices, Bend testing, Electromechanical devices, Semiconductor technology, Semiconductor devices, Fatigue testing, Integrated circuits, Test equipment
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Méthode de mesure des limites de formage des matériaux à couche métallique
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Verfahren zur Ermittlung der Grenzformänderung metallischer Dünnschichtwerkstoffe
CommitteeEPL/47
ISBN978 0 580 72297 4
PublisherBSI
FormatA4
DeliveryYes
Pages22
File Size762 KB
Price£130.00


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