BS EN 62047-18:2013 - Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials

BS EN 62047-18:2013

Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials

Status : Current   Published : October 2013

Format
PDF

Format
HARDCOPY



IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.




Standard NumberBS EN 62047-18:2013
TitleSemiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
StatusCurrent
Publication Date31 October 2013
Normative References(Required to achieve compliance to this standard)EN 62047-6:2010, IEC 62047-6:2009
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 62047-18:2013,IEC 62047-18:2013
Draft Superseded By11/30230316 DC
DescriptorsSemiconductor technology, Bend testing, Test specimens, Test equipment, Resonance, Integrated circuits, Semiconductor devices, Fatigue testing, Thin-film devices, Electromechanical devices, Vibration, Electronic equipment and components
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositif microélectromécaniques. Méthodes d’essai de flexion des matériaux en couche mince
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Biegeprüfverfahren für Dünnschichtwerkstoffe
CommitteeEPL/47
ISBN978 0 580 72011 6
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size660 KB
Price£130.00


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