BS EN 60191-6-18:2010 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

BS EN 60191-6-18:2010

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)

Status : Current   Published : April 2010

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PDF

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HARDCOPY






Standard NumberBS EN 60191-6-18:2010
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
StatusCurrent
Publication Date30 April 2010
Normative References(Required to achieve compliance to this standard)EN 60191-6, IEC 60191-6
Informative References(Provided for Information)IEC 60191-6-2, IEC 60191-6-4, IEC 60191-6-5
International RelationshipsIEC 60191-6-18:2010/COR1:2010
Amended ByCorrigendum, October 2010
DescriptorsElectronic equipment and components, Semiconductor devices, Engineering drawings, Design, Packages, Surface mounting devices, Integrated circuits, Technical drawing, Drawings, Designations, Interchangeability, Standardization, Dimensions
ICS31.080.01
Title in FrenchNormalisation mécanique des dispositifs à semiconducteurs. Règles générales pour la préparation des dessins d'encombrement des dispositifs à semiconducteurs pour montage en surface. Guide de conception pour les boîtiers matriciels à billes (BGA)
Title in GermanMechanische Normung von Halbleiterbauelementen. Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen. Konstruktionsleitfaden für Ball-Grid-Array (BGA)
CommitteeEPL/47
ISBN978 0 580 71947 9
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size1.674 MB
Price£182.00


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