DD IEC/PAS 62647-3:2011 - Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Performance testing for systems containing lead-free solder and finishes

DD IEC/PAS 62647-3:2011

Process management for avionics. Aerospace and defence electronic systems containing lead-free solder. Performance testing for systems containing lead-free solder and finishes

Status : Superseded, Withdrawn   Published : September 2011 Replaced By : PD IEC/TS 62647-3:2014

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IEC/PAS 62647-3:2011(E) addresses the evaluation of failure mechanisms, thru performance testing, expected in electronic products containing lead-free (Pb-free) solder.




Standard NumberDD IEC/PAS 62647-3:2011
TitleProcess management for avionics. Aerospace and defence electronic systems containing lead-free solder. Performance testing for systems containing lead-free solder and finishes
StatusSuperseded, Withdrawn
Publication Date30 September 2011
Withdrawn Date31 March 2014
Normative References(Required to achieve compliance to this standard)IEC/PAS 62647-22, MIL-HDBK-217F:1991, IPC/JEDEC-9703, NASA-DoD LFE Test Protocol:2007, IPC-SM-785:1992, IPC-9701A:2006, IEC/PAS 62647-1, 2002/95/EC, GEIA-STD-0005-1:2006, IEC/PAS 62647-2, GEIA-HB-0005-2:2007, GEIA-HB-0005-1:2006, IEC/PAS 62647-21, GEIA-STD-0005-2:2006, JESD22-B110A:2004, MIL-STD-810:2000
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByPD IEC/TS 62647-3:2014
International RelationshipsIEC/PAS 62647-3:2011
DescriptorsLead alloys, Repair, Lead-free alloys, Production management, Defence, Environmental testing, Printed circuits, Fluxes (materials), Finishes, Soldering, Performance testing, Aircraft components, Air transport engineering, Electronic equipment and components, Solders, Printed-circuit boards
ICS03.100.50
31.020
49.060
CommitteeGEL/107
ISBN978 0 580 71846 5
PublisherBSI
FormatA4
DeliveryNo
Pages46
File Size1.481 MB
Price£218.00


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