BS EN 62047-15:2015 - Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass

BS EN 62047-15:2015

Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass

Status : Current   Published : July 2015

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PDF

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HARDCOPY



IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.




Standard NumberBS EN 62047-15:2015
TitleSemiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
StatusCurrent
Publication Date31 July 2015
Normative References(Required to achieve compliance to this standard)EN 62047-9, IEC 62047-9
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 62047-15:2015,IEC 62047-15:2015
Draft Superseded By14/30217668 DC
DescriptorsThin films, Electronic equipment and components, Test specimens, Electromechanical devices, Axial stress, Semiconductor technology, Test equipment, Tensile testing, Semiconductor devices
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Méthode d'essai de la résistance de collage entre PDMS et verre
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Prüfverfahren zur Bondqualität zwischen PDMS und Glas
CommitteeEPL/47
ISBN978 0 580 70802 2
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size1.36 MB
Price£130.00


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