BS EN 61182-2-2:2012 - Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description

BS EN 61182-2-2:2012

Printed board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description

Status : Current   Published : August 2012

Format
PDF

Format
HARDCOPY



IEC 61182-2-2:2012 provides the information on the manufacturing requirements used for fabricating printed boards. This standard determines the XML schema details, defined in the generic standard IEC 61182-2 and some of the sectional standards that are required to accomplish the focused tasks. When other standards are invoked, their requirements become a mandatory part of the fabrication details as defined in the IEC 61182-2.




Standard NumberBS EN 61182-2-2:2012
TitlePrinted board assembly products. Manufacturing description data and transfer methodology. Sectional requirements for implementation of printed board fabrication data description
StatusCurrent
Publication Date31 August 2012
Normative References(Required to achieve compliance to this standard)EN 60194, IEC 60194, IEC 61182-2
Informative References(Provided for Information)IEC 61182-2-1, IPC-2511, IPC-2581, ASTM 380-72, IPC-7351, IPC-T-50, ANSI Y32.1, IPC-D-325, ANSI Y14.5, IEC 61188-5-2, EDIF 4 0 0, AP 221, IPC-2614, IPC-D-310, IPC-2584, IPC-2582, ANSI Y32.16, IPC-2615, IEC 61182-2-4, IEC 61188-5-5, AP 220, ISO 10303-212, IEC 61182-2-3, ISO 10303-210:2014, IEC 61188-5-1, DoD-STD-100, IPC-2588, IPC-2583, ANSI X3/TR-1-77, IEC 61188-5-4, IPC-2221, ANSI X3.12, IPC-2501, IEC 61188-5-8, IEC 61188-5-3, ANSI Z210.1, IEC 61188-5-6
International RelationshipsEN 61182-2-2:2012,IEC 61182-2-2:2012
Draft Superseded By09/30214979 DC
DescriptorsElectrical testing, Data organization, Printed-circuit boards, Thickness, Data processing, Data representation, Data transfer, Printed circuits, Electrical resistivity, Production, Design, Dimensional tolerances, Information exchange, Assembling, Electronic equipment and components, Printed-circuit bases
ICS31.180
Title in FrenchProduits pour cartes imprimées équipées. Données descriptives de fabrication et méthodologie de transfert. Exigences intermédiaires pour la mise en oeuvre de cartes imprimées. Description des données de fabrication
Title in GermanLeiterplatten. Beschreibung und Transfer von Daten. Anforderungen für die Anwendung von Dokumentationsdaten der Leiterplattenfertigung
CommitteeEPL/501
ISBN978 0 580 70189 4
PublisherBSI
FormatA4
DeliveryYes
Pages48
File Size1.671 MB
Price£240.00


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