BS EN 62047-13:2012 - Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

BS EN 62047-13:2012

Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Status : Current   Published : May 2012

Format
PDF

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HARDCOPY



IEC 62047-13:2012 specifies the adhesive testing method between micro-sized elements and a substrate using the columnar shape of the specimens. This international standard can be applied to adhesive strength measurement of microstructures, prepared on a substrate, with width and thickness of 1 ?m to 1 mm, respectively. This standard specifies the adhesive testing method for micro-sized-elements in order to optimally select materials and processing conditions for MEMS devices. This standard does not particularly restrict test piece material, test piece size and performance of the measuring device, since the materials and size of MEMS device components range widely and testing machine for micro-sized materials has not been generalized.




Standard NumberBS EN 62047-13:2012
TitleSemiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
StatusCurrent
Publication Date31 May 2012
Normative References(Required to achieve compliance to this standard)IEC 62047-2:2006, EN 62047-2:2006
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 62047-13:2012,IEC 61097-4:2012/AMD1:2016,IEC 62047-13:2012
Draft Superseded By10/30211454 DC
DescriptorsSemiconductor devices, Semiconductor technology, Electromechanical devices, Test equipment, Resonance, Integrated circuits, Bend testing, Test specimens, Fatigue testing, Electronic equipment and components, Thin-film devices, Vibration
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Méthodes d'essais de types courbure et cisaillement de mesure de la résistance d'adhérence pour les structures MEMS
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Biege- und Scherprüfverfahren zur Messung der Haftfestigkeit bei MEMSStrukturen
CommitteeEPL/47
ISBN978 0 580 69450 9
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size644 KB
Price£130.00


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