BS EN 62047-10:2011 - Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials

BS EN 62047-10:2011

Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials

Status : Current   Published : September 2011

Format
PDF

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HARDCOPY



IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.




Standard NumberBS EN 62047-10:2011
TitleSemiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
StatusCurrent
Publication Date30 September 2011
Normative References(Required to achieve compliance to this standard)IEC 62047-8, EN 62047-8
Informative References(Provided for Information)ASTM E9-89a
International RelationshipsEN 62047-10:2011,IEC 62047-10:2011
Draft Superseded By10/30211442 DC
DescriptorsCompression testing, Semiconductor technology, Test specimens, Electronic equipment and components, Stress, Integrated circuits, Electromechanical devices, Semiconductor devices, Strain measurement
ICS31.080.99
Title in FrenchDispositifs à semiconducteur. Dispositifs microélectromécaniques. Essai de compression utilisant la technique des micro-piliers pour les matériaux des MEMS
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Druckprüfverfahren an zylinderförmigen Mikroproben für Werkstoffe der Mikrosystemtechnik
CommitteeEPL/47
ISBN978 0 580 69447 9
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size416 KB
Price£130.00


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