DD IEC/PAS 62326-14:2010 - Printed boards. Device embedded substrate. Terminology / reliability / design guide

DD IEC/PAS 62326-14:2010

Printed boards. Device embedded substrate. Terminology / reliability / design guide

Status : Current   Published : November 2010

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PDF

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HARDCOPY



IEC/PAS 62326-14:2010(E) is applicable to device embedded substrates fabricated by embedding discrete active and passive electronic devices into an inner layer of a substrate with electric connections by vias, conductor plating, conductive paste, and printing. The device embedded substrate may be used as a substrate to mount SMDs to form electronic circuits, as conductor and insulator layers may be formed after embedding electronic devices. The purpose of this PAS is to obtain common understanding in design, fabrication and use of device embedded substrates in the industry. This PAS describes the substrate embedding devices including but not limited to module, integrated passive device (IPD), microelectrochemical systems (MEMS), discrete component formed in the fabrication process of the electronic wiring board, and sheet form component. This PAS does not specify the fabrication process of device embedded substrates, via diameter/via land diameter, conductor width/conductor spacing nor conductor line density.




Standard NumberDD IEC/PAS 62326-14:2010
TitlePrinted boards. Device embedded substrate. Terminology / reliability / design guide
StatusCurrent
Publication Date30 November 2010
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)JPCA-TD01-2008, JIS C 1302:2002, JIS C 5012:1993, JIS C 5603:1993, JPCA-BU01-2007, UL 94
International RelationshipsIEC/PAS 62326-14:2010
DescriptorsPrinted-circuit boards, Printed circuits, Electronic equipment and components, Printed-circuit bases, Printed wiring, Terminology, Classification systems, Reliability, Design, Substrates (insulating), Electrical insulating materials, Electric connectors, Integrated circuits
ICS31.180
CommitteeEPL/501
ISBN978 0 580 69325 0
PublisherBSI
FormatA4
DeliveryYes
Pages66
File Size2.05 MB
Price£254.00


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