BS EN 60749-34:2010 - Semiconductor devices. Mechanical and climatic test methods. Power cycling

BS EN 60749-34:2010

Semiconductor devices. Mechanical and climatic test methods. Power cycling

Status : Current   Published : February 2011



IEC 60749-34:2010 describes a test method used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed, causing rapid changes of temperature. The power cycling test is intended to simulate typical applications in power electronics and is complementary to high temperature operating life (see IEC 60749-23). Exposure to this test may not induce the same failure mechanisms as exposure to air-to-air temperature cycling, or to rapid change of temperature using the two-fluid-baths method. This test causes wear-out and is considered destructive. This second edition cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant changes with respect from the previous edition include:

- the specification of tighter conditions for more accelerated power cycling in the wire bond fatigue mode;

- information that under harsh power cycling conditions high current densities in a thin die metalization might initiate electromigration effects close to wire bonds.

Standard NumberBS EN 60749-34:2010
TitleSemiconductor devices. Mechanical and climatic test methods. Power cycling
Publication Date28 February 2011
Normative References(Required to achieve compliance to this standard)EN 60749-23, IEC 60747-6:2000, IEC 60747-1:2006, IEC 60749-23, EN 60749-3:2017, IEC 60747-2:2000, IEC 60749-3:2017
Informative References(Provided for Information)IEC 60747, IEC 60748
ReplacesBS EN 60749-34:2004
International RelationshipsEN 60749-34:2010,IEC 60749-34:2010
Draft Superseded By09/30209939 DC
DescriptorsSemiconductor devices, Stress analysis, Electrical testing, Power losses, Thermal stress, Mechanical testing, Electronic equipment and components, Climate, Low voltage, Stress, Integrated circuits, Environmental testing, Destructive testing
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques. Cycles en puissance
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren. Lastwechselprüfung
ISBN978 0 580 69164 5
File Size496 KB

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