BS EN 60749-21:2011 - Semiconductor devices. Mechanical and climatic test methods. Solderability

BS EN 60749-21:2011

Semiconductor devices. Mechanical and climatic test methods. Solderability

Status : Current   Published : August 2011



IEC 60749-21:2011 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment. This test method provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application. The test method also provides optional conditions for ageing. This test is considered destructive unless otherwise detailed in the relevant specification.

NOTE 1 This test method is in general accord with IEC 60068, but due to specific requirements of semiconductors, the following text is applied.

NOTE 2 This test method does not assess the effect of thermal stresses which may occur during the soldering process. Reference should be made IEC 60749-15 or IEC 60749-20.

This standard cancels and replaces the first edition published in 2004 and constitutes a technical revision. The significant change is the inclusion of Pb (lead)-free backward compatibility.

Standard NumberBS EN 60749-21:2011
TitleSemiconductor devices. Mechanical and climatic test methods. Solderability
Publication Date31 August 2011
Normative References(Required to achieve compliance to this standard)IEC 61190-1-2:2007, IEC 61190-1-3:2007, EN 61190-1-2:2007, EN 61190-1-3:2007
Informative References(Provided for Information)IEC 60749-15:2003, IEC 60068, IEC 60749, IEC 60068-2-69:2007, IEC 60749-20:2008
ReplacesBS EN 60749-21:2005
International RelationshipsEN 60749-21:2011,IEC 60749-21:2011
Draft Superseded By09/30209670 DC
DescriptorsEnvironmental testing, Solderability testing, Soldering, Semiconductor devices, Thermal testing, Surface mounting devices, Integrated circuits, Electronic equipment and components, Mechanical testing
Title in FrenchDispositifs à semiconducteur. Méthodes d'essai mécaniques et climatiques. Brasabilité
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren. Lötbarkeit
ISBN978 0 580 69115 7
File Size584 KB

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