BS EN 61189-11:2013 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys

BS EN 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys

Status : Current   Published : July 2013

Format
PDF

Format
HARDCOPY



IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.




Standard NumberBS EN 61189-11:2013
TitleTest methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys
StatusCurrent
Publication Date31 July 2013
Normative References(Required to achieve compliance to this standard)EN 61189-3, IEC 61190-1-3, ISO 11357-1, EN ISO 11357-1, IEC 60194, EN 60194, ISO 9453, EN ISO 9453, EN 61190-1-3, IEC 61189-3
Informative References(Provided for Information)IEC 61189-1
International RelationshipsEN 61189-11:2013,IEC 61189-11:2013
Draft Superseded By09/30208696 DC16/30352938 DC
DescriptorsElectrical testing, Peeling tests, Dimensional measurement, Fire tests, Printed-circuit boards, Precision, Accuracy, Thermal testing, Solderability testing, Reports, Electronic equipment and components, Mechanical testing, Printed circuits, Environmental testing, Electrical insulating materials, Visual inspection (testing)
ICS31.180
Title in FrenchMéthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles. Mesure de la température de fusion ou des plages de températures de fusion des alliages à braser
Title in GermanPrüfverfahren für Elektromaterialien, Leiterplatten und andere Verbindungsstrukturen und Baugruppen. Messung der Schmelztemperatur und Schmelztemperaturbereiche von Lotlegierungen
CommitteeEPL/501
ISBN978 0 580 68869 0
PublisherBSI
FormatA4
DeliveryYes
Pages20
File Size3.632 MB
Price£130.00


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