BS EN 60749-19:2003+A1:2010 - Semiconductor devices. Mechanical and climatic test methods. Die shear strength

BS EN 60749-19:2003+A1:2010

Semiconductor devices. Mechanical and climatic test methods. Die shear strength

Status : Current   Published : June 2003

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PDF

Format
HARDCOPY






Standard NumberBS EN 60749-19:2003+A1:2010
TitleSemiconductor devices. Mechanical and climatic test methods. Die shear strength
StatusCurrent
Publication Date20 June 2003
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsEN 60749-19:2003/A1:2010,IEC 60749-19:2003/AMD1:2010
Amended ByAmendment, October 2010
Draft Superseded By09/30208058 DC
DescriptorsIntegrated circuits, Substrates (insulating), Quality control, Environmental testing, Strength of materials, Semiconductor devices, Shear testing, Shear strength, Electrical components, Climate, Mechanical testing, Electrical equipment, Electronic equipment and components
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques. Résistance de la pastille au cisaillement
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren. Prüfung der Chip-Bondfestigkeit
CommitteeEPL/47
ISBN978 0 580 68745 7
PublisherBSI
FormatA4
DeliveryYes
Pages10
File Size437 KB
Price£110.00


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