BS EN 62137-3:2012 - Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

BS EN 62137-3:2012

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

Status : Current   Published : March 2012

Format
PDF

Format
HARDCOPY



IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:


- no technical changes;


- some editorial changes and corrections;


- for the sake of convenience some constitutive changes.




Standard NumberBS EN 62137-3:2012
TitleElectronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
StatusCurrent
Publication Date31 March 2012
Normative References(Required to achieve compliance to this standard)EN 62137-1-5:2009, EN 62137-1-1:2007, IEC 61249-2-7, EN 62137-1-4:2009, EN 61188-5, EN 61249-2-7, IEC 62137-1-4:2009, EN 62137-1-3:2009, IEC 62137-1-2:2007, EN 60194, IEC 61188-5, IEC 62137-1-5:2009, IEC 60194, IEC 62137-1-1:2007, IEC 62137-1-3:2008, EN 62137-1-2:2007
Informative References(Provided for Information)IEC 60068-2-2:1974, IEC 61760-1, IEC 62137:2004, IEC 60068-2-14, IEC 60068-1:1998, IEC 60068-2-78
ReplacesDD IEC/PAS 62137-3:2008
International RelationshipsIEC 61310-3:2007,EN 61310-3:2008,EN 62137-3:2012,IEC 62137-3:2011
Draft Superseded By04/30117619 DC09/30206176 DC
DescriptorsSolders, Electronic equipment and components, Mechanical testing, Environmental testing, Surface mounting devices, Soldering, Life (durability), Integrated circuits, Soldered joints, Thermal testing, Printed-circuit boards, Endurance testing
ICS31.190
Title in FrenchTechniques d'assemblage des composants électroniques. Guide de choix des méthodes d'essai d'environnement et d'endurance des joints brasés
Title in GermanMontageverfahren für elektronische Baugruppen. Leitfaden für die Auswahl von Umwelt- und (Lebens)dauerprüfungen für Lötverbindungen
CommitteeEPL/501
ISBN978 0 580 68370 1
PublisherBSI
FormatA4
DeliveryYes
Pages47
File Size1.189 MB
Price£240.00


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