BS IEC 62615:2010 - Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level

BS IEC 62615:2010

Electrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level

Status : Current   Published : July 2011



IEC 62615:2010 defines a method for pulse testing to evaluate the voltage current response of the component under test and to consider protection design parameters for electro-static discharge (ESD) human body model (HBM). This technique is known as transmission line pulse (TLP) testing. This document establishes a methodology for both testing and reporting information associated with transmission line pulse (TLP) testing. The scope and focus of this document pertains to TLP testing techniques of semiconductor components. This document should not become alternative method of HBM test standard such as IEC 60749-26. The purpose of the document is to establish guidelines of TLP methods that allow the extraction of HBM ESD parameters on semiconductor devices. This document provides the standard measurement and procedure for the correct extraction of HBM ESD parameters by using TLP.

Standard NumberBS IEC 62615:2010
TitleElectrostatic discharge sensitivity testing. Transmission line pulse (TLP). Component level
Publication Date31 July 2011
Normative References(Required to achieve compliance to this standard)IEC 60749-27, IEC 60749-28, IEC 60749-26
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC 62615:2010
Draft Superseded By08/30195574 DC
DescriptorsCurrent measurement, Waveforms, Electrical measurement, Voltage measurement, Electric charge, Semiconductors, Electrostatics, Semiconductor devices, Sensitivity, Electronic equipment and components, Integrated circuits
Title in FrenchEssai de sensibilité aux décharges électrostatiques. Impulsion de ligne de transmission (TLP). Niveau composant
Title in GermanPrüfung der Empfindlichkeit gegen elektrostatische Entladungen. TLP-Verfahren. Beanspruchung auf Bauelementeniveau
ISBN978 0 580 65874 7
File Size1.048 MB

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