BS EN 61190-1-3:2007+A1:2010 - Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

BS EN 61190-1-3:2007+A1:2010

Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Status : Superseded, Withdrawn   Published : July 2007 Replaced By : BS EN IEC 61190-1-3:2018

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Standard NumberBS EN 61190-1-3:2007+A1:2010
TitleAttachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
StatusSuperseded, Withdrawn
Publication Date31 July 2007
Withdrawn Date28 March 2018
Normative References(Required to achieve compliance to this standard)IEC 61190-1-2, EN 61190-1-2:2007, IEC 61190-1-1:2002, IEC 61189-6, EN 61190-1-1:2002, ISO 9001, ISO 9454-2:1998, EN ISO 9001:2000, IEC 60194, EN 29454-1:1993, EN 60194:2006, IEC 61189-5, EN ISO 9454-2:2000, EN 61189-5:2006, EN ISO 9453:2006, ISO 9453:2006, EN 61189-6:2006, ISO 9454-1:1990
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN IEC 61190-1-3:2018
ReplacesBS EN 61190-1-3:2002
International RelationshipsCLC/TR 61340-5-2(IEC 61340-5-2,EN 61190-1-3 Amd 1 (09/10) IEC,IEC 61190-1-3:2007/AMD1:2010,IEC 62862-3-3 Ed.1.0
Amended ByAmendment, March 2011
Draft Superseded By09/30190431 DC
DescriptorsQuality control, Quality assurance, Classification systems, Electrical connections, Test methods, Pastes, Solders, Electronic engineering, Bonding, Bars (materials), Fluxes (materials), Particulate materials, Electronic equipment and components, Soldering
ICS31.190
Title in FrenchMatériaux de fixation pour les assemblages électroniques. Exigences relatives aux alliages à braser de catégorie électronique et brasures solides fluxées et non fluxées pour les applications de brasage électronique
Title in GermanVerbindungsmaterialien für Baugruppen der Elektronik. Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel für das Löten von Elektronikprodukten
CommitteeEPL/501
ISBN978 0 580 64639 3
PublisherBSI
FormatA4
DeliveryYes
Pages40
File Size1.042 MB
Price£214.00


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