BS EN 60191-6-21:2010 - Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

BS EN 60191-6-21:2010

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)

Status : Under review, Current   Published : December 2010

Format
PDF

Format
HARDCOPY



IEC 60191-6-21:2010 specifies methods to measure package dimensions of small outline packages (SOP), package outline form E in accordance to IEC 60191-4.




Standard NumberBS EN 60191-6-21:2010
TitleMechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
StatusUnder review, Current
Publication Date31 December 2010
Normative References(Required to achieve compliance to this standard)EN 60191-6, IEC 60191-4, EN 60191-4, IEC 60191-6
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC TR 62453-62:2017,IEC 60191-6-21:2010,EN 61557-5:2007,EN 60191-6-21:2010
Draft Superseded By08/30190030 DC
DescriptorsPrinted-circuit boards, Dimensions, Semiconductor devices, Drawings, Electric connectors, Electronic equipment and components, Surface mounting devices, Integrated circuits, Engineering drawings, Standardization
ICS25.040.40
31.080.01
35.100.05
35.110
Title in FrenchNormalisation mécanique des dispositifs à semiconducteurs. Règles générales pour la préparation des dessins d'encombrement des boîtiers pour dispositifs à semiconducteurs pour montage en surface. Méthodes de mesure pour les dimensions des boîtiers de faible encombrement (SOP)
Title in GermanMechanische Normung von Halbleiterbauelementen. Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen. Messverfahren für Gehäusemaße von kleinen Gehäusen (SOP)
CommitteeEPL/47
ISBN978 0 580 64567 9
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size1.054 MB
Price£130.00


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