DD IEC/PAS 62137-3:2008 - Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints – BSI British Standards

DD IEC/PAS 62137-3:2008

Electronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints

Status : Superseded, Withdrawn   Published : January 2009 Replaced By : BS EN 62137-3:2012

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DD IEC/PAS 62137-3:2009 describes the selection of an appropriate test method for reliability testing of solder joints. The test methods given are applicable to evaluate the strength of joints of a component mounted on printed wiring board, but not to test the mechanical strength of components themselves.

The test conditions for accelerated tests (rapid temperature change and high temperature tests) may exceed the maximum allowable temperature range for a component.

Contents of DD IEC/PAS 62137-3:2009

• FOREWORD
• INTRODUCTION
• Scope
• Normative references
• Terms and definitions
• Procedure of selecting the applicable test method
• Stress to solder joints in the field and test methods
• Selection of test methods based on the shapes and terminals of electronic
• components
• Common subjects in each test method
• Mounting device and materials used
• Soldering condition
• Accelerated endurance test
• Selection of test conditions and analysis of test results
• Test method
• Body strength test of SMD before and after the rapid temperature change test
• Cyclic bending strength test
• Mechanical shear fatigue test
• Cyclic drop test
• Strength test of leaded component
• Fillet lifting phenomenon observation of leaded component
• Annex A (informative) Condition of rapid temperature change test
• Annex B (informative) Soldered joint test by electrical conduction
• Annex C (informative) Torque shear strength test
• Annex D (informative) Monotonic bending strength test
• Annex E (informative) Cyclic steel ball drop strength test
• Annex F (informative) Pull strength test
• Annex G (informative) Creep strength test
• Annex H (informative) Fillet lifting phenomenon observation of leaded component solder
• joint and the life test by electrical conduction




Standard NumberDD IEC/PAS 62137-3:2008
TitleElectronics assembly technology. Selection guidance of environmental and endurance test methods for solder joints
StatusSuperseded, Withdrawn
Publication Date31 January 2009
Withdrawn Date31 March 2012
Normative References(Required to achieve compliance to this standard)IEC 60068-1:1988, IEC 60068-1:1988/AMD 1:1992, IEC 60068-2-2:2007, IEC 60068-2-14:1984, IEC 60068-2-14:1984/AMD 1:1986, IEC 60068-2-78:2001, IEC 60194:2006, IEC 61188-5, IEC 61190-1-1:2002, IEC 61190-1-2:2007, IEC 61249-2-7:2002, IEC 62137:2005, IEC 62137-1-1:2007, IEC 62137-1-2:2007, IEC 62137-1-3, IEC 62137-1-4, IEC 62137-1-5
Informative References(Provided for Information)IEC 60068-2-21, IEC 60068-2-2, IEC 60068-1
Replaced ByBS EN 62137-3:2012
International RelationshipsIEC/PAS 62137-3:2008
DescriptorsElectronic equipment and components, Surface mounting devices, Integrated circuits, Printed-circuit boards, Soldered joints, Soldering, Solders, Environmental testing, Endurance testing, Mechanical testing, Thermal testing, Life (durability)
ICS31.190
Title in GermanMontageverfahren für elektronische Baugruppen. Leitfaden für die Auswahl von Umwelt- und (Lebens)dauerprüfungen für Lötverbindungen
CommitteeEPL/501
ISBN978 0 580 64126 8
PublisherBSI
FormatA4
DeliveryNo
Pages46
File Size1.86 MB
Price£240.00


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