BS EN 60191-6-19:2010 - Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

BS EN 60191-6-19:2010

Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Status : Current   Published : June 2010

Format
PDF

Format
HARDCOPY



This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.




Standard NumberBS EN 60191-6-19:2010
TitleMechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
StatusCurrent
Publication Date30 June 2010
Normative References(Required to achieve compliance to this standard)EN 60749-20, IEC 60191-6-2, EN 60191-6-2, EN 60191-6-5, IEC 60191-6-5, IEC 60749-20
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsEN 60191-6-19:2010,IEC 60191-6-19:2010,IEC PAS 60191-6-19:2008
Draft Superseded By08/30172909 DC
DescriptorsTechnical data sheets, Dimensions, Dimensional measurement, Integrated circuits, Curved, Convex, Semiconductor devices, Surface mounting devices, Heating tests, Concave, Thermal testing, Electronic equipment and components, Standardization
ICS31.080.01
Title in FrenchNormalisation mécanique des dispositifs à semiconducteurs. Méthodes de mesure du gauchissement des boîtiers à température élevée et du gauchissement maximum admissible
Title in GermanMechanische Normung von Halbleiterbauelementen. Messverfahren für die Gehäuse-Verbiegung bei erhöhter Temperatur und die maximal zulässige Verbiegung
CommitteeEPL/47
ISBN978 0 580 60758 5
PublisherBSI
FormatA4
DeliveryYes
Pages18
File Size1.483 MB
Price£130.00


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