BS EN 62047-8:2011 - Semiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films

BS EN 62047-8:2011

Semiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films

Status : Current   Published : June 2011

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IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.




Standard NumberBS EN 62047-8:2011
TitleSemiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films
StatusCurrent
Publication Date30 June 2011
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 62047-2:2006, IEC 62047-3:2006
International RelationshipsEN 60512-13-1:2006,EN 62047-8:2011,IEC 62026-3:2014/COR1:2015,IEC 62047-8:2011
Draft Superseded By08/30172398 DC
DescriptorsElectronic equipment and components, Bend testing, Semiconductor technology, Strips, Test equipment, Tensile testing, Electromechanical devices, Test specimens, Thin films, Semiconductor devices, Integrated circuits
ICS31.080.99
Title in FrenchDispositifs à semiconducteurs. Dispositifs microélectromécaniques. Méthode d'essai de la flexion de bandes en vue de la mesure des propriétés de traction des couches minces
Title in GermanHalbleiterbauelemente. Bauelemente der Mikrosystemtechnik. Streifen-Biege-Prüfverfahren zur Messung von Zugbeanspruchungsmerkmalen dünner Schichten
CommitteeEPL/47
ISBN978 0 580 60629 8
PublisherBSI
FormatA4
DeliveryYes
Pages22
File Size1.487 MB
Price£130.00


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