BS EN 61188-5-8:2008 - Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

BS EN 61188-5-8:2008

Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)

Status : Current   Published : May 2008

Format
PDF

Format
HARDCOPY



IEC 61188-5-8:2007 provides information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder joint, and also allow for inspection, testing and reworking of those solder joints.



This publication is to be read in conjunction with

IEC 61188-5-1:2002

.




Standard NumberBS EN 61188-5-8:2008
TitlePrinted boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA)
StatusCurrent
Publication Date30 May 2008
Normative References(Required to achieve compliance to this standard)EN 60068-2-58:2004, IEC 60068-2-58, EN 61188-5-1:2002, EN 60068-2-58:2004/Corrigendum:2004, EN 62090:2003, IEC 61188-5-1, IEC 60191-2, IEC 62090:2017
Informative References(Provided for Information)EN 61191-1:1998, IEC 61191-1:2018, BS EN IEC 61191-1:2018
International RelationshipsEN 61188-5-8:2008,IEC 61188-5-8:2007
DescriptorsElectronic equipment and components, Dimensional tolerances, Printed circuits, Printed-circuit boards, Soldered joints, Design, Soldering, Patterns, Surface mounting devices, Shape, Dimensions
ICS31.180
Title in FrenchCartes imprimées et cartes imprimées équipées. Conception et utilisation. Considérations sur les liaisons pistes-soudures. Composants matriciels (BGA, FBGA, CGA, LGA)
Title in GermanLeiterplatten und Elektronikaufbauten auf Leiterplatten. Konstruktion und Anwendung. Sektionale Anforderungen. Betrachtungen zur Montage (Landefläche/Verbindung). Flächenmatrix-Bauelemente (BGA, FBGA, CGA, LGA)
CommitteeEPL/501
ISBN978 0 580 59958 3
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size869 KB
Price£214.00


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