Standard Number | BS EN 61191-6:2010 |
Title | Printed board assemblies. Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods |
Status | Current |
Publication Date | 31 May 2010 |
Normative References(Required to achieve compliance to this standard) | IEC 60068-1:1988, EN 60068-1:1994, IEC 60068-1:1998/AMD 1:1992, IEC 60194:2006, IEC 60068-1:1998, EN 60194:2006, IEC 60068-1:1988/AMD 1:1992 |
Informative References(Provided for Information) | IPC-7095B:2008, IEC 61190-1-3:2007, BS EN IEC 61191-1:2018, IEC 61191-1:2018 |
International Relationships | EN 61191-6:2010,IEC 61191-6:2010 |
Draft Superseded By | 07/30169763 DC |
Descriptors | Soldered joints, Holes, Printed circuits, Measurement, Microassembling, Integrated circuits, Electronic equipment and components, Printed-circuit boards, Surface mounting devices, Soldering |
ICS | 31.180
|
Title in French | Ensembles de cartes imprimées. Critères dévaluation des vides dans les joints brasés des boîtiers BGA et LGA et méthode de mesure |
Title in German | Elektronikaufbauten auf Leiterplatten. Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode |
Committee | EPL/501 |
ISBN | 978 0 580 59929 3 |
Publisher | BSI |
Format | A4 |
Delivery | Yes |
Pages | 42 |
File Size | 1.88 MB |
Price | £218.00 |