BS EN 61191-6:2010 - Printed board assemblies. Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

BS EN 61191-6:2010

Printed board assemblies. Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods

Status : Current   Published : May 2010

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IEC 61191-6:2010 specifies the evaluation criteria for voids on the scale of the thermal cycle life, and the measurement method of voids using X-ray observation. This part of IEC 61191 is applicable to the voids generated in the solder joints of BGA and LGA soldered on a board. This part of IEC 61191 is not applicable to the BGA package itself before it is assembled on a board. This standard is applicable also to devices having joints made by melt and re-solidification, such as flip chip devices and multi-chip modules, in addition to BGA and LGA. This standard is not applicable to joints with under-fill between a device and a board, or to solder joints within a device package. This standard is applicable to macrovoids of the sizes of from 10 µm to several hundred micrometres generated in a soldered joint, but is not applicable to smaller voids (typically, planar microvoids) with a size of smaller than 10 µm in diameter. This standard is intended for evaluation purposes and is applicable to research studies, off-line production process control and reliability assessment of assembly.




Standard NumberBS EN 61191-6:2010
TitlePrinted board assemblies. Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
StatusCurrent
Publication Date31 May 2010
Normative References(Required to achieve compliance to this standard)IEC 60068-1:1988, EN 60068-1:1994, IEC 60068-1:1998/AMD 1:1992, IEC 60194:2006, IEC 60068-1:1998, EN 60194:2006, IEC 60068-1:1988/AMD 1:1992
Informative References(Provided for Information)IPC-7095B:2008, IEC 61190-1-3:2007, BS EN IEC 61191-1:2018, IEC 61191-1:2018
International RelationshipsEN 61191-6:2010,IEC 61191-6:2010
Draft Superseded By07/30169763 DC
DescriptorsSoldered joints, Holes, Printed circuits, Measurement, Microassembling, Integrated circuits, Electronic equipment and components, Printed-circuit boards, Surface mounting devices, Soldering
ICS31.180
Title in FrenchEnsembles de cartes imprimées. Critères dévaluation des vides dans les joints brasés des boîtiers BGA et LGA et méthode de mesure
Title in GermanElektronikaufbauten auf Leiterplatten. Bewertungskriterien für Hohlräume in Lötverbindungen von BGA und LGA und Messmethode
CommitteeEPL/501
ISBN978 0 580 59929 3
PublisherBSI
FormatA4
DeliveryYes
Pages42
File Size1.88 MB
Price£214.00


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