BS EN 60749-20:2009 - Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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BS EN 60749-20:2009

Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Status : Current, Work in hand   Published : January 2010

Format
PDF

Format
HARDCOPY



IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:


- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;


- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;


- update for lead-free solder;


- correct certain errors in the original Edition 1.




Standard NumberBS EN 60749-20:2009
TitleSemiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
StatusCurrent, Work in hand
Publication Date31 January 2010
Normative References(Required to achieve compliance to this standard)EN 60749-35:2006, IEC 60068-2-20:2008, EN 60749-3:2002, IEC 60749-35, EN 60068-2-20:2008, IEC 60749-3:2017
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60749-20:2003
International RelationshipsEN 60749-20:2009,IEC 60749-20:2008,IEC 62298-3:2005,EN 62298-3:2005
Draft Superseded By03/301830 DC07/30168484 DC
DescriptorsMechanical testing, Solderability testing, Soldering, Integrated circuits, Semiconductor devices, Electronic equipment and components, Environmental testing, Damp-heat tests, Surface mounting devices, Encapsulated, Thermal testing, Climate, Plastics
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques. Résistance des CMS à boîtiers plastique à l'effet combiné de l'humidité et de la chaleur de brasage
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren. Beständigkeit kunststoffverkappter oberflächenmontierbarer Bauelemente (SMD) gegenüber der kombinierten Beanspruchung von Feuchte und Lötwärme
CommitteeEPL/47
ISBN978 0 580 59478 6
PublisherBSI
FormatA4
DeliveryYes
Pages32
File Size1.227 MB
Price£182.00


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