BS EN 62137-1-5:2009 - Surface mounting technology. Environmental and endurance test methods for surface mount solder joints. Mechanical shear fatigue test
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BS EN 62137-1-5:2009

Surface mounting technology. Environmental and endurance test methods for surface mount solder joints. Mechanical shear fatigue test

Status : Current   Published : July 2009

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IEC 62137-1-5:2009 applies to area array packages, such as BGA. This test method is designed to evaluate the fatigue life of the solder joints between component leads and lands on a substrate as shown in Figure 1. A temperature cyclic approach is generally used to evaluate the reliability of solder joints. Another method is to mechanically cycle the solder joints to shorten the testing time rather than to produce the strains by changing temperatures. The methodology is the imposition of shear deformation on the solder joints by mechanical displacement instead of relative displacement generated by CTE (coefficient of thermal expansion) mismatch, as shown in Figure 2. In place of the temperature cycle test, the mechanical shear fatigue predicts the reliability of the solder joints under repeated temperature change conditions by mechanically cycling the solder joints. In this test method, the evaluation requires first to mount the surface mount component on the substrate by reflow soldering, then cyclic mechanical shear deformation is applied to the solder joints until fracture of the solder joints occurs. The properties of the solder joints (for example solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.




Standard NumberBS EN 62137-1-5:2009
TitleSurface mounting technology. Environmental and endurance test methods for surface mount solder joints. Mechanical shear fatigue test
StatusCurrent
Publication Date31 July 2009
Normative References(Required to achieve compliance to this standard)EN 61188-5, EN 60194:2006, IEC 61190-1-3, IEC 60194, EN 60068-1:1994, EN 61190-1-2:2007, EN 61190-1-3:2007, EN 61249-2-7:2002/Corrigendum:2005, IEC 61249-2-7:2002, IEC 60068-1, EN 61760-1:2006, IEC 61190-1-2:2007, IEC 61760-1, EN 61249-2-7:2002, IEC 61188-5
Informative References(Provided for Information)IEC 61188-5-8, IEC 60068-2-21
International RelationshipsIEC 62137-1-5:2009,EN 62137-1-5:2009,EN 50121-1:2006
DescriptorsFatigue testing, Integrated circuits, Surface mounting, Soldering, Environmental testing, Printed-circuit boards, Soldered joints, Endurance testing, Shear testing, Surface mounting devices, Mechanical testing
ICS31.190
Title in FrenchTechnologie du montage en surface. Méthodes d'essais d'environnement et d'endurance des joints brasés montés en surface. Essai de fatigue par cisaillement mécanique
Title in GermanOberflächenmontage-Technik. Verfahren zur Prüfung auf Umgebungseinflüsse und zur Prüfung der Haltbarkeit von Oberflächen-Lötverbindungen. Prüfung der Ermüdung durch mechanische Scherbeanspruchung
CommitteeEPL/501
ISBN978 0 580 59253 9
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size1.141 MB
Price£182.00


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