BS EN 62258-1:2010 - Semiconductor die products. Procurement and use

BS EN 62258-1:2010

Semiconductor die products. Procurement and use

Status : Current   Published : November 2010

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PDF

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HARDCOPY



IEC 62258-1:2009 has been developed to facilitate the production, supply and use of semiconductor die products, including:


- wafers,


- singulated bare die,


- die and wafers with attached connection structures,


- minimally or partially encapsulated die and wafers.


This standard defines the minimum requirements for the data that are needed to describe such die products and is intended as an aid to the design of and procurement for assemblies incorporating die products. It covers the requirements for data, including:


- product identity,


- product data,


- die mechanical information,


- test, quality, assembly and reliability information,


- handling, shipping and storage information.


The main changes that have been introduced in this edition have been to ensure consistency across all parts of the standard. The ordering of the subclauses, particularly in Clause 6, has been changed to be more logical and the text of some of the requirements has been amended to add requirements on further information as covered by IEC/TR 62258-4, IEC/TR 62258-7 and IEC/TR 62258-8. New requirements include information on permutability of terminals and functional elements (6.6.4) and moisture sensitivity for partially encapsulated devices (8.8).




Standard NumberBS EN 62258-1:2010
TitleSemiconductor die products. Procurement and use
StatusCurrent
Publication Date30 November 2010
Normative References(Required to achieve compliance to this standard)ISO 14644-1:1999, IEC 60191-4:1999/AMD 2:2002, IEC 62258-2, IEC 60191, EN 60191-4:1999/AMD 2:2002, IEC/TR 62258-7, EN 62258-5, EN 60191-4:1999, EN 60191-4:1999/AMD 1:2002, EN 62258-6, IEC 61360-1, IEC/TR 62258-8, IEC/TR 62258-3, CLC/TR 62258-3, EN 60191, CLC/TR 62258-8, IEC 60191-4:1999/AMD 1:2001, EN ISO 14644-1:1999, EN 62258-2, IEC 62258-5, CLC/TR 62258-4, IEC 62258-6, IEC 60191-4:1999, IEC/TR 62258-4, IEC 60050, CLC/TR 62258-7, EN 61360-1
Informative References(Provided for Information)IPC/JEDEC J-STD-033B:2005, IEC 60749-26:2018, IEC 60749-27, ISO 9000, ANSI/EIA 599, IPC/EIA J-STD-028:1999, IEC 61340-5-2, ANSI/EIA 557-A, IEEE 1076, IPC/JEDEC J-STD-020C:2004, IEC 61340-5-1, MIL-PRF-38534, EIAJ EDR-4703:1999, ISO 8879, EIAJ EDR-4701B:1996, IPC/EIA J-STD-026:1999, ISO 10303, EIA/JEDEC JESD46, EIA/JEDEC JESD16, MIL-STD-883, IEEE 1029.1, ANSI/EIA 554, MIL-PRF-19500, JEDEC J-STD-012:1996, ISO/IEC:11179-3, EIA/JEDEC JEP95, FED-STD-209, IEC 60068
ReplacesBS EN 62258-1:2005
International RelationshipsEN 61526:2007,EN 62258-1:2010,IEC 62258-1:2009
DescriptorsPurchasing, Dimensions, Electronic equipment and components, Mechanical properties of materials, Semiconductors, Terminology, Semiconductor devices, Electric connectors, Geometry, Design, Integrated circuits, Product information, Data, Substrates (insulating)
ICS31.080.99
Title in FrenchProduits de puces de semiconducteurs. Approvisionnement et utilisation
Title in GermanHalbleiter-Chip-Erzeugnisse Beschaffung und Anwendung
CommitteeEPL/47
ISBN978 0 580 59110 5
PublisherBSI
FormatA4
DeliveryYes
Pages48
File Size1.145 MB
Price£240.00


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