DD IEC/PAS 61249-3-1:2007 - Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

DD IEC/PAS 61249-3-1:2007

Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Status : Current   Published : October 2007

Format
PDF

Format
HARDCOPY



Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types




Standard NumberDD IEC/PAS 61249-3-1:2007
TitleMaterials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
StatusCurrent
Publication Date31 October 2007
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsIEC/PAS 61249-3-1:2007
DescriptorsPrinted-circuit boards, Printed circuits, Printed-circuit bases, Coated materials, Copper, Laminates, Sheet materials, Foil, Flexible materials, Adhesives, Designations, Dimensions, Specification (approval)
ICS31.180
Title in GermanMaterialien für Leiterplatten und andere Verbindungsstrukturen. Kupferkaschierte Laminate für flexible Leiterplatten (Ausführungen mit und ohne Kleber-Zwischenschicht)
CommitteeEPL/501
ISBN978 0 580 59472 4
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size881.1 KB
Price£182.00


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