BS EN 60068-2-83:2011 - Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

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BS EN 60068-2-83:2011

Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Status : Current   Published : November 2011

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IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.


NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.




Standard NumberBS EN 60068-2-83:2011
TitleEnvironmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
StatusCurrent
Publication Date30 November 2011
Cross ReferencesIEC 60068-1, IEC 60068-2-20:2008, IEC 60068-2-58, IEC 60194, IEC 61190-1-3, EN 60068-1, EN 60068-2-20:2008, EN 60068-2-58, EN 60194, EN 61190-1-3
International RelationshipsEN 60068-2-83:2011,IEC 60068-2-83:2011
Draft Superseded By07/30165180 DC
DescriptorsSurface mounting devices, Electrical equipment, Electric terminals, Testing conditions, Wettability, Solderability testing, Environmental testing, Test equipment, Electronic equipment and components, Electrical components, Solders, Pastes, Specimen preparation
ICS19.040
31.190
Title in FrenchEssais d'environnement. Essais. Essais Tf. Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage utilisant de la pâte à braser
Title in GermanUmweltprüfungen. Prüfungen. Prüfung Tf. Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage unter Verwendung von Lotpaste
CommitteeEPL/501
ISBN978 0 580 58835 8
PublisherBSI
FormatA4
DeliveryYes
Pages42
File Size1.5 MB
Price£214.00


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