PD IEC/TR 62258-7:2007 - Semiconductor die products. XML schema for data exchange

PD IEC/TR 62258-7:2007

Semiconductor die products. XML schema for data exchange

Status : Current   Published : November 2007

Format
PDF

Format
HARDCOPY



This technical report has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers, singulated bare die, die and wafers attached connection structures and minimally or partially encapsulated die and wafers. This report contains an XML schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of IEC 62258-1, IEC 62258-5 and IEC 62258-6, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC/TR 62258-4.




Standard NumberPD IEC/TR 62258-7:2007
TitleSemiconductor die products. XML schema for data exchange
StatusCurrent
Publication Date30 November 2007
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
International RelationshipsCLC/TR 62258-7:2007,IEC TR 62258-7:2007
DescriptorsSemiconductor devices, Information exchange, Integrated circuits, Semiconductors, Substrates (insulating), Data processing, Electronic equipment and components, Markup, Data
ICS31.080.99
Title in GermanHalbleiter-Chip-Erzeugnisse. XML-Schema für den Datenaustausch
CommitteeEPL/47
ISBN978 0 580 58267 7
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size1.14 MB
Price£182.00


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