PD IEC/TR 60068-3-12:2007 - Environmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

PD IEC/TR 60068-3-12:2007

Environmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile

Status : Revised, Superseded, Withdrawn   Published : April 2007 Replaced By : PD IEC/TR 60068-3-12:2014

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Presents two approaches to establish a possible temperature profile for a lead-free reflow soldering process using SnAgCu solder paste. The presented process window covers a great variety of electronic products, including a large range of package sizes (molded active electronic components, passive components and electromechanical components)




Standard NumberPD IEC/TR 60068-3-12:2007
TitleEnvironmental testing. Supporting documentation and guidance. Method to evaluate a possible lead-free solder reflow temperature profile
StatusRevised, Superseded, Withdrawn
Publication Date30 April 2007
Withdrawn Date31 October 2014
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 60584-2, IEC 60068-2-58
Replaced ByPD IEC/TR 60068-3-12:2014
International RelationshipsIEC/TR 60068-3-12:2007
Draft Superseded By06/30150315 DC
DescriptorsEnvironmental testing, Thermal testing, Solders, Electrical components, Lead-free alloys, Electronic equipment and components, Testing conditions, Heating tests, Electrical equipment, Printed-circuit boards, Solderability testing, Thermal resistance
ICS19.040
Title in GermanUmgebungseinflüsse. Unterstützende Dokumentation und Leitfaden. Verfahren zur Ermittlung und Bewertung eines möglichen Temperaturprofils für den bleifreien Reflow-Lötprozess
CommitteeEPL/501
ISBN978 0 580 50516 4
PublisherBSI
FormatA4
DeliveryNo
Pages20
File Size1.674 MB
Price£130.00


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