BS EN 61760-1:2006 - Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)

BS EN 61760-1:2006

Surface mounting technology. Standard method for the specification of surface mounting components (SMDs)

Status : Current, Work in hand   Published : September 2006

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IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:


- requirements related to lead-free soldering;


- extension of the scope to include also components mounted by gluing;


- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;


- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.




Standard NumberBS EN 61760-1:2006
TitleSurface mounting technology. Standard method for the specification of surface mounting components (SMDs)
StatusCurrent, Work in hand
Publication Date29 September 2006
Normative References(Required to achieve compliance to this standard)EN 62090:2003, IEC 60068-2-45:1980/AMD 1:1993, EN 60749, EN 60068-2-21:1999, EN 60068-2-77:1999, EN 60191-6:2004, EN 61760-2:1998, IEC 60068-2-21, IEC 60286-5:2018, EN 60068-2-45:1992, IEC 62090:2017, IEC 60068-2-45:1980, BS EN IEC 60286-5:2018, BS EN 60861:2008, IEC 60068, EN 60068-2-58:2004, EN 60286-6:2004, EN 60286-3:1998, ISO 8601, EN 60194:2006, IEC 60749, IEC 60068-2-77, EN 60286-4:1998, EN 60068, EN 60286-5:2004, EN 61340-5-1:2001, IEC 61340-5-3, IEC 60191-6:2004, IEC 60062, IEC 61760-2, IEC 60286-6, IEC 61340-5-1, IEC 60286-4, IEC 60194, IEC 60286-3, IEC 60068-2-58, EN 60068-2-45:1992/AMD 1:1993, EN 60062:2005
Informative References(Provided for Information)EN 60068-1:1994, EN 60068-2-69:1996, IEC 60068-1, IEC 60068-2-20, IEC 60068-2-69
ReplacesBS EN 61760-1:1999, IEC 61760-1:1998
International RelationshipsEN 61760-1:2006,IEC 61760-1:2006
DescriptorsIntegrated circuits, Thermal testing, Surface mounting devices, Marking, Identification methods, Test duration, Classification systems, Soldering, Electronic equipment and components, Ageing tests, Technical writing, Solderability testing, Cleaning, Wettability, Packaging, Thermal resistance, Integrated circuit technology, Visual inspection (testing), Testing conditions, Electrical components, Accelerated testing
ICS31.020
31.240
Title in FrenchTechnique du montage en surface. Methode de normalisation pour la specification des composants montes en surface (CMS)
Title in GermanOberflaechenmontagetechnik. Genormtes Verfahren zur Spezifizierung oberflaechenmontierbarer Bauelemente (SMDs)
CommitteeEPL/501
ISBN0 580 49213 3
PublisherBSI
FormatA4
DeliveryYes
Pages34
File Size989 KB
Price£214.00


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