BS EN 61760-2:2007 - Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide

BS EN 61760-2:2007

Surface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide

Status : Current   Published : July 2007

Format
PDF

Format
HARDCOPY



IEC 61760-2:2007 describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive (Conditions for printed boards are not taken into consideration). The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning". This second edition cancels and replaces the first edition, published in 1998, and constitutes a technical revision. The standard was updated and editorially revised.




Standard NumberBS EN 61760-2:2007
TitleSurface mounting technology. Transportation and storage conditions of surface mounting devices (SMD). Application guide
StatusCurrent
Publication Date31 July 2007
Normative References(Required to achieve compliance to this standard)EN 61340-5-1:2001/Corrigendum:2001, EN 60721-3-1:1997, IEC 60286-3, EN 60286-3:200X, EN 60286-4:1998, IEC 60721-3-1, IEC/TS 61340-5-1, IEC/TS 61340-5-2, EN 60286-5:2004, EN 60749, EN 61340-5-1:2001, IEC 60286-4, IEC 60286-6, EN 60286-6:2004, IEC 60721-3-2, IEC 60749, EN 61340-5-2:2001/Corrigendum:2001, EN 60721-3-2:1997, EN 61340-5-2:2001, IEC 60286-5:2018, BS EN IEC 60286-5:2018, BS EN 60861:2008
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 61760-2:1998, IEC 61760-2:1998
International RelationshipsEN 61760-2:2007,EN 62148-1:2002,IEC 61760-2:2007
Draft Superseded By05/30143441 DC
DescriptorsIntegrated circuit technology, Electrical components, Environment (working), Safety measures, Storage, Rail transport, Transportation, Integrated circuits, Surface mounting devices, Electronic equipment and components, Road transport, Packaging, Air transport
ICS31.020
31.240
Title in FrenchTechnique du montage en surface. Transport et stockage des composants pour montage en surface (CMS). Guide d'application
Title in GermanOberflächenmontagetechnik. Transport- und Lagerungsbedingungen von oberflächenmontierbaren Bauelementen (SMD). Anwendungsleitfaden
CommitteeEPL/501
ISBN978 0 580 56232 7
PublisherBSI
FormatA4
DeliveryYes
Pages12
File Size605 KB
Price£110.00


 Your basket
Your basket is empty

Multi-user access to over 3,500 medical device standards, regulations, expert commentaries and other documents


Tracked Changes

Understand the changes made to a standard with our new Tracked Changes version


BSOL

The faster, easier way to work with standards


Worldwide Standards
We can source any standard from anywhere in the world