BS EN 62258-6:2006 - Semiconductor die products. Requirements for information concerning thermal simulation

BS EN 62258-6:2006

Semiconductor die products. Requirements for information concerning thermal simulation

Status : Current   Published : November 2006

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Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2




Standard NumberBS EN 62258-6:2006
TitleSemiconductor die products. Requirements for information concerning thermal simulation
StatusCurrent
Publication Date30 November 2006
Normative References(Required to achieve compliance to this standard)IEC 62258-1, IEC 62258-2
Informative References(Provided for Information)EIA/JESD51-5, EIA/JESD51, EIA/JESD51-8, EIA/JESD51-1, EIA/JESD51-9, EIA/JESD51-2, EN 62258-1:2005, EIA/JESD51-6, EN 62258-2:2005
ReplacesPD ES 59008-4-3:2000, ES 59008-4-3:1999
International RelationshipsEN 62258-6:2006,IEC 62258-6 Ed.1.0
Draft Superseded By05/30139923 DC
DescriptorsSimulation, Verification, Conformity, Semiconductor devices, Substrates (insulating), Semiconductors, Test models, Electronic equipment and components, Integrated circuits, Data, Thermal resistance, Thermal conductivity, Thermal properties of materials
ICS31.080.99
Title in FrenchProduits de matrice de semi-conducteur. Exigences pour l'information concernant la simulation thermique
Title in GermanHalbleiter-Chip-Erzeugnisse. Anforderungen fuer Angaben hinsichtlich der thermischen Simulation
CommitteeEPL/47
ISBN0 580 49609 0
PublisherBSI
FormatA4
DeliveryYes
Pages14
File Size882 KB
Price£110.00


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