BS EN 60068-2-69:2007 - Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method – BSI British Standards

BS EN 60068-2-69:2007

Environmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Status : Superseded, Withdrawn   Published : July 2007 Replaced By : BS EN 60068-2-69:2017+A1:2019

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BS EN 60068-2-69:2007outlines test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices. These methods determine quantitatively the solderability of terminations on surface mounting devices.

BS EN 60068-2-69:2007 is also available for surface mounting devices and should be consulted if applicable. The procedures describe the solder bath wetting balance method and the solder globule wetting balance method and are both applicable to components with metallic terminations and metallized solder pads.

BS EN 60068-2-69:2007provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.




Standard NumberBS EN 60068-2-69:2007
TitleEnvironmental testing. Tests. Test Te. Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
StatusSuperseded, Withdrawn
Publication Date31 July 2007
Withdrawn Date10 July 2017
Normative References(Required to achieve compliance to this standard)ISO 6362, IEC 61190-1-3:2002, IEC 60068-1, ISO 683, IEC 60068-2-20:1979, IEC 60068-2-54:2006, IEC 60068-2-20:1979/AMD 2:1987
Informative References(Provided for Information)EN 60068-2-44:1995, IEC 61190-1-1:2002, EN 61190-1-3:2002, ISO 9453:2006, EN ISO 9453:2006, EN 61190-1-1:2002, HD 323.2.20 S3:1988, EN 60068-1:1994, EN 60068-2-54:2006, EN 29454-1:1993, IEC 60068-2-44:1995, ISO 9454-1:1990
Replaced ByBS EN 60068-2-69:2017+A1:2019
ReplacesBS EN 60068-2-69:1996, IEC 60068-2-69:1995
International RelationshipsEN 60068-2-69:2007,IEC 60068-2-69:2007
Draft Superseded By05/30139830 DC
DescriptorsElectronic equipment and components, Electrical components, Surface mounting devices, Testing conditions, Solders, Wettability, Specimen preparation, Electrical equipment, Environmental testing, Solderability testing, Electric terminals, Test equipment
ICS19.040
31.190
Title in FrenchEssais d'environnement. Essais. Essai Te. Essai de brasabilité des composants électroniques pour les composants pour montage en surface (CMS) par la méthode de la balance de mouillage
Title in GermanUmgebungseinflüsse. Prüfungen. Prüfung Te. Prüfung der Lötbarkeit von Bauelementen der Elektronik für Oberflächenmontage (SMD) mit der Benetzungswaage
CommitteeEPL/501
ISBN978 0 580 55860 3
PublisherBSI
FormatA4
DeliveryYes
Pages28
File Size572 KB
Price£182.00


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