BS EN 60068-2-20:2008 - Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads

BS EN 60068-2-20:2008

Environmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads

Status : Withdrawn   Published : January 2009 Replaced By : BS EN IEC 60068-2-20:2021

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IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:


- the solder globule test is deleted;


- test conditions and requirements for lead-free solders are added.




Standard NumberBS EN 60068-2-20:2008
TitleEnvironmental testing. Tests. Test T. Test methods for solderability and resistance to soldering heat of devices with leads
StatusWithdrawn
Publication Date31 January 2009
Withdrawn Date13 May 2021
Normative References(Required to achieve compliance to this standard)IEC 61191-3:2017, IEC 60068-2-2:1974, IEC 61191-4:2017, EN 60068-2-2:2007, EN 60068-2-66:1994, IEC 60194, EN 60194:2006, EN 61191-4:1998, EN 61191-3:1998, EN 60068-2-78:2001, IEC 60068-2-66, IEC 60068-2-78, EN 60068-1:1994, IEC 60068-1
Informative References(Provided for Information)EN 61190-1-3:2007, IEC 60068-2-58, EN 60068-2-54:2006, IEC 60068-2-69, IEC 61190-1-3, EN 60068-2-58:2004, EN 60068-2-69:2007, IEC 60068-2-54
Replaced ByBS EN IEC 60068-2-20:2021
ReplacesBS 2011-2.1T:1981, IEC 60068-2-20:1979
International RelationshipsIEC 60068-2-20:2008,EN 60115-9-1:2004,EN 60068-2-20:2008
Draft Superseded By05/30138801 DC
DescriptorsElectronic equipment and components, Thermal testing, Test equipment, Printed-circuit boards, Wettability, Testing conditions, Electrical equipment, Thermal resistance, Environmental testing, Specimen preparation, Ageing (materials), Soldering, Fluxes (materials), Electrical components, Heating tests
ICS19.040
31.040.10
Title in FrenchEssais d'environnement. Essais. Essai T. Méthodes d'essai pour la brasabilité et la résistance à la chaleur de brasage des dispositifs plombés
Title in GermanUmgebungseinflüsse. Prüfungen. Prüfung T. Prüfverfahren für die Lötbarkeit und Lötwärmebeständigkeit von Bauelementen mit herausgeführten Anschlüssen
CommitteeEPL/501
ISBN978 0 580 55763 7
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size1.188 MB
Price£186.00


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