Standard Number | BS EN 61190-1-2:2007 |
Title | Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly |
Status | Revised, Superseded, Withdrawn |
Publication Date | 31 July 2007 |
Withdrawn Date | 30 June 2014 |
Normative References(Required to achieve compliance to this standard) | IEC 61190-1-1, EN ISO 9453:2006, EN 61191-4:1998, EN 61189-6:2006, EN ISO 9001:2000, IEC 61189-6, IEC 61189-5, ISO 9000, EN ISO 9000:2005, EN 30012-1:1993, EN 61191-1:1998, ISO 9453, EN 61190-1-1:2002, IEC 61190-1-3, EN ISO 9454-2:2000, IEC 60194, EN 60194:2006, ISO 9454-2, EN 61189-5:2006, EN 61191-3:1998, ISO 9001, ISO 10012-1, EN 61190-1-3:2007, EN 61191-2:1998, IEC 61191-3:2017, BS EN IEC 61191-1:2018, IEC 61191-1:2018, IEC 61191-2:2017, IEC 61191-4:2017 |
Informative References(Provided for Information) | No other standards are informatively referenced |
Replaced By | BS EN 61190-1-2:2014 |
Replaces | BS EN 61190-1-2:2002 |
International Relationships | EN 60191-4:1999/A1:2002,EN 61190-1-2:2007,IEC 61190-1-2:2007 |
Draft Superseded By | 05/30133283 DC |
Descriptors | Quality control, Bonding, Quality assurance, Solders, Electronic equipment and components, Electrical connections, Pastes, Soldering, Electronic engineering, Classification systems, Soldered connectors |
ICS | 31.190
|
Title in French | Matériaux de fixation pour les assemblages électroniques. Exigences relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques |
Title in German | Verbindungsmaterialien für Baugruppen der Elektronik. Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage |
Committee | EPL/501 |
ISBN | 978 0 580 55336 3 |
Publisher | BSI |
Format | A4 |
Delivery | No |
Pages | 22 |
File Size | 1.359 MB |
Price | £134.00 |