BS EN 61190-1-2:2007 - Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly

BS EN 61190-1-2:2007

Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly

Status : Revised, Superseded, Withdrawn   Published : July 2007 Replaced By : BS EN 61190-1-2:2014

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IEC 61190-1-2:2007 specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. The main changes with regard to the first edition concern a definition of lead-free solder alloy and an explanation of solder ball test standards.




Standard NumberBS EN 61190-1-2:2007
TitleAttachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
StatusRevised, Superseded, Withdrawn
Publication Date31 July 2007
Withdrawn Date30 June 2014
Normative References(Required to achieve compliance to this standard)IEC 61190-1-1, EN ISO 9453:2006, EN 61191-4:1998, EN 61189-6:2006, EN ISO 9001:2000, IEC 61189-6, IEC 61189-5, ISO 9000, EN ISO 9000:2005, EN 30012-1:1993, EN 61191-1:1998, ISO 9453, EN 61190-1-1:2002, IEC 61190-1-3, EN ISO 9454-2:2000, IEC 60194, EN 60194:2006, ISO 9454-2, EN 61189-5:2006, EN 61191-3:1998, ISO 9001, ISO 10012-1, EN 61190-1-3:2007, EN 61191-2:1998, IEC 61191-3:2017, BS EN IEC 61191-1:2018, IEC 61191-1:2018, IEC 61191-2:2017, IEC 61191-4:2017
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 61190-1-2:2014
ReplacesBS EN 61190-1-2:2002
International RelationshipsEN 60191-4:1999/A1:2002,EN 61190-1-2:2007,IEC 61190-1-2:2007
Draft Superseded By05/30133283 DC
DescriptorsQuality control, Bonding, Quality assurance, Solders, Electronic equipment and components, Electrical connections, Pastes, Soldering, Electronic engineering, Classification systems, Soldered connectors
ICS31.190
Title in FrenchMatériaux de fixation pour les assemblages électroniques. Exigences relatives aux crèmes de brasage pour les interconnexions de haute qualité dans les assemblages de composants électroniques
Title in GermanVerbindungsmaterialien für Baugruppen der Elektronik. Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage
CommitteeEPL/501
ISBN978 0 580 55336 3
PublisherBSI
FormatA4
DeliveryNo
Pages22
File Size1.359 MB
Price£134.00


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