BS EN 60068-2-58:2004 - Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

BS EN 60068-2-58:2004

Environmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Status : Revised, Superseded, Withdrawn   Published : November 2004 Replaced By : BS EN 60068-2-58:2015+A1:2018

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This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.




Standard NumberBS EN 60068-2-58:2004
TitleEnvironmental testing. Tests. Test Td. Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
StatusRevised, Superseded, Withdrawn
Publication Date19 November 2004
Withdrawn Date31 May 2015
Normative References(Required to achieve compliance to this standard)IEC 60068-2-20:1979, IEC 61190-1-2:2002, IEC 61190-1-1:2002, EN 61191-2:1998, EN 60749-20:2003, EN 60068-1:1994, HD 323.2.20 S3:1988, EN 61190-1-1:2002, EN 61249-2-7:2002, EN 61190-1-2:2002, EN 61760-1:1998, IEC 61190-1-3:2002, IEC 61249-2-7:2002, EN 61190-1-3:2002, IEC 60749-20:2002, IEC 60068-2-44:1995, IEC 60068-1:1988, IEC 61191-2:1998, IEC 61760-1:1998, IEC 60194:1999
Informative References(Provided for Information)IEC 60068-2-69:1995, IEC 60068-2-54:1985
Replaced ByBS EN 60068-2-58:2015+A1:2018
ReplacesBS EN 60068-2-58:1999, IEC 60068-2-58:1999
International RelationshipsIEC 60068-2-58:2004,EN 60068-2-58 (IEC 60068-2-58:
Amended ByAMD 15599
Corrigendum, April 2005
DescriptorsElectrical equipment, Solderability testing, Environmental testing, Grades (quality), Thermal resistance, Chemical-resistance tests, Heating tests, Electrical components, Testing conditions, Surfaces, Electronic equipment and components, Thermal testing, Visual inspection (testing)
ICS19.040
31.190
Title in FrenchEssais d'environnement. Essais. Essai Td. Methodes d'essai de la soudabilite, de la resistance de la metallisation a la dissolution et de la resistance a la chaleur de soudage des composants pour montage en surface (CMS)
Title in GermanUmweltpruefungen. Pruefungen. Pruefung Td. Pruefverfahren fuer Loetbarkeit, Widerstandsfaehigkeit gegenueber Aufloesen der Metallisierung und Loetwaermebestaendigkeit bei oberflaechenmontierbaren Bauelementen (SMD)
CommitteeEPL/501
ISBN0 580 44773 1
PublisherBSI
FormatA4
DeliveryNo
Pages30
File Size1.081 MB
Price£182.00


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