Standard Number | BS EN 60749-35:2006 |
Title | Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components |
Status | Current |
Publication Date | 30 November 2006 |
Normative References(Required to achieve compliance to this standard) | No other standards are normatively referenced |
Informative References(Provided for Information) | IEC 60749-20, EN 60749-20:2003 |
International Relationships | EN 60749-35:2006,EN 61140:2002,IEC 60749-35:2006 |
Draft Superseded By | 04/30117780 DC |
Descriptors | Integrated circuits, Mechanical testing, Non-destructive testing, Microscopic analysis, Semiconductor devices, Plastics, Encapsulated, Electronic equipment and components, Test equipment, Environmental testing, Packages, Ultrasonic testing, Climate |
ICS | 31.080.01
|
Title in French | Dispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Microscopie acoustique pour composants electroniques a boitier plastique |
Title in German | Halbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Ultraschallmikroskopie fuer kunststoffverkappte Bauelemente der Elektronik |
Committee | EPL/47 |
ISBN | 0 580 49739 9 |
Publisher | BSI |
Format | A4 |
Delivery | Yes |
Pages | 24 |
File Size | 1.109 MB |
Price | £186.00 |