BS EN 60749-35:2006 - Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components

BS EN 60749-35:2006

Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components

Status : Current   Published : November 2006

Format
PDF

Format
HARDCOPY



Defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. Provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.




Standard NumberBS EN 60749-35:2006
TitleSemiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components
StatusCurrent
Publication Date30 November 2006
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)IEC 60749-20, EN 60749-20:2003
International RelationshipsEN 60749-35:2006,EN 61140:2002,IEC 60749-35:2006
Draft Superseded By04/30117780 DC
DescriptorsIntegrated circuits, Mechanical testing, Non-destructive testing, Microscopic analysis, Semiconductor devices, Plastics, Encapsulated, Electronic equipment and components, Test equipment, Environmental testing, Packages, Ultrasonic testing, Climate
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Microscopie acoustique pour composants electroniques a boitier plastique
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Ultraschallmikroskopie fuer kunststoffverkappte Bauelemente der Elektronik
CommitteeEPL/47
ISBN0 580 49739 9
PublisherBSI
FormatA4
DeliveryYes
Pages24
File Size1.109 MB
Price£182.00


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