| Standard Number | BS EN 60749-35:2006 |
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| Title | Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components |
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| Status | Current |
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| Publication Date | 30 November 2006 |
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| Normative References(Required to achieve compliance to this standard) | No other standards are normatively referenced |
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| Informative References(Provided for Information) | IEC 60749-20, EN 60749-20:2003 |
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| International Relationships | EN 60749-35:2006,EN 61140:2002,IEC 60749-35:2006 |
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| Draft Superseded By | 04/30117780 DC |
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| Descriptors | Integrated circuits, Mechanical testing, Non-destructive testing, Microscopic analysis, Semiconductor devices, Plastics, Encapsulated, Electronic equipment and components, Test equipment, Environmental testing, Packages, Ultrasonic testing, Climate |
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| ICS | 31.080.01
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| Title in French | Dispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Microscopie acoustique pour composants electroniques a boitier plastique |
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| Title in German | Halbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Ultraschallmikroskopie fuer kunststoffverkappte Bauelemente der Elektronik |
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| Committee | EPL/47 |
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| ISBN | 0 580 49739 9 |
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| Publisher | BSI |
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| Format | A4 |
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| Delivery | Yes |
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| Pages | 24 |
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| File Size | 1.109 MB |
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| Price | £186.00 |
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