BS EN 60749-39:2006 - Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

BS EN 60749-39:2006

Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

Status : Current   Published : December 2006

Format
PDF

Format
HARDCOPY



Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.




Standard NumberBS EN 60749-39:2006
TitleSemiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
StatusCurrent
Publication Date29 December 2006
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
ReplacesBS EN 60749:1999, IEC 60749:1996
International RelationshipsEN 60749-39:2006,IEC 60749-39:2006
Draft Superseded By04/30126896 DC
DescriptorsSolubility, Environmental testing, Diffusion, Moisture measurement, Water, Moisture control, Mechanical testing, Electronic equipment and components, Semiconductor devices
ICS31.080.01
Title in FrenchDispositifs a semiconducteurs. Methodes d'essais mecaniques et climatiques. Mesure de la diffusion d'humidite et de l'hydrosolubilite dans les materiaux organiques utilises dans les composants a semiconducteurs
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Pruefverfahren. Messung des Feuchtediffusionskoeffizienten und der Wasserloeslichkeit in organischen Werkstoffen, welche bei Halbleiter-Komponenten verwendet werden
CommitteeEPL/47
ISBN0 580 49866 2
PublisherBSI
FormatA4
DeliveryYes
Pages12
File Size1.295 MB
Price£110.00


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