DD IEC/PAS 62050:2004 - Board level drop test method of components for handheld electronicproduc ts

DD IEC/PAS 62050:2004

Board level drop test method of components for handheld electronicproduc ts

Status : Superseded, Withdrawn   Published : January 2006 Replaced By : BS EN 60749-37:2008

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The Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test. The purpose of this document is to prescribe a standardized test method and reporting procedure.




Standard NumberDD IEC/PAS 62050:2004
TitleBoard level drop test method of components for handheld electronicproduc ts
StatusSuperseded, Withdrawn
Publication Date11 January 2006
Withdrawn Date30 May 2008
Normative References(Required to achieve compliance to this standard)No other standards are normatively referenced
Informative References(Provided for Information)No other standards are informatively referenced
Replaced ByBS EN 60749-37:2008
International RelationshipsIEC/PAS 62050:2004
DescriptorsElectronic equipment and components, Printed-circuit boards, Semiconductor devices, Surface mounting devices, Drop tests, Mechanical testing, Accelerated testing, Impact testing
ICS31.080.01
Title in GermanLeiterplatten. Fall-Pruefung fuer Bauteile in tragbaren elektronischen Geraeten
CommitteeEPL/47
ISBN0 580 45953 5
PublisherBSI
FormatA4
DeliveryNo
Pages22
File Size1.56 MB
Price£130.00


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