BS EN 60749-20-1:2009 - Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Status : Current, Work in hand   Published : July 2009

Format
PDF

Format
HARDCOPY



IEC 60749-20-1:2009 applies to all non-hermetic SMD packages which are subjected to reflow solder processes and which are exposed to the ambient air. The purpose of this document is to provide SMD manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow sensitive SMDs which have been classified to the levels defined in IEC 60749-20. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved, with the dry packing process, providing a minimum shelf life capability in sealed dry-bags from the seal date.




Standard NumberBS EN 60749-20-1:2009
TitleSemiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
StatusCurrent, Work in hand
Publication Date31 July 2009
Normative References(Required to achieve compliance to this standard)IEC 60749-20, EN 60749-20, IEC 60749-30, EN 60749-30:2005
Informative References(Provided for Information)IPC/JEDEC J-STD-033, IEC 60749-39, IEC 60749-37
International RelationshipsEN 60749-20-1:2009,IEC 60749-20-1:2009
Draft Superseded By04/30119207 DC
DescriptorsPackaging, Materials handling, Surface mounting devices, Thermal testing, Environment (working), Soldering, Labelling (process), Environmental testing, Climate, Integrated circuits, Damp-heat tests, Electronic equipment and components, Semiconductor devices, Transportation, Mechanical testing
ICS31.080.01
Title in FrenchDispositifs à semiconducteurs. Méthodes d'essais mécaniques et climatiques. Manipulation, emballage, étiquetage et transport des composants pour montage en surface sensibles à l'effet combiné de l'humidité et de la chaleur de brasage
Title in GermanHalbleiterbauelemente. Mechanische und klimatische Prüfverfahren. Handhabung, Verpackung, Kennzeichnung und Transport oberflächenmontierbarer Bauelemente, die empfindlich gegen die Kombination von Feuchte und Lötwärme sind
CommitteeEPL/47
ISBN978 0 580 54601 3
PublisherBSI
FormatA4
DeliveryYes
Pages38
File Size977 KB
Price£214.00


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